Reduction of processing time for SiC and GaN | Porous diamond grinding wheel for clogging elimination
Ideal cutting performance and whetstone lifespan! Are you wasting your whetstone with dressing?
"UNIVA-X" is a grinding wheel that achieves high-efficiency processing and reduces total costs. The size and thickness of the honeycomb provide ideal cutting performance and grinding wheel lifespan. The abrasive grains in the core enhance processing efficiency through the action of free abrasive grains. Additionally, load distribution can be controlled through diamond patterning. 【Features】 ■ Ideal cutting performance and grinding wheel lifespan through the size and thickness of the honeycomb ■ Abrasive grains in the core enhance processing efficiency through the action of free abrasive grains ■ Maximizes non-dress and dress intervals ■ Load distribution can be controlled through diamond patterning ■ Achieves high-efficiency processing and reduces total costs *For more details, please refer to the PDF document or feel free to contact us.
- Company：ナノテム
- Price：Other
